info@jinshentech.com

Shenzhen Jinshen Photoelectric Technology Co., Ltd

PCB Assembly


 

Engineer

Before we start to assemble, we need to collect all the things we need.

These are BOM list (which prefers to the component list here), pick&place file, stencil, a final product picture or 3D stimulation picture.

Making a PCB - PCB Manufacture step by step

PCBA Capability

Item Capability Item Capability
Solder PastePrinting Accuracy:,±0.025mm Wave Soldering Nitrogen source: external
Max. speed: 150mm/sec Speed: 5in² /sec (60FOV/sec)
PCB max. area: 400*310mm Temperature accuracy: ±1°C
PCB thickness: 0.2-6mm Lead free compatible
SMT Accuracy: ±0.03mm AOI  
Speed: 0.17sec/pc Accuracy: ±0.0024mm
PCB max. area: 350*350mm Speed: 5in² /sec (60FOV/sec)
Available part: 0201 chip to 35*35mm PCB max. area:300*300mm
Accuracy: ±0.05mm Available component: 0201 chip and fine pitch
PCB max. area: 350*350mm X-ray,Inspection  
Available part: 0402 chips to 14mm (H 12mm) BGA void(0.5mm distance between Ball)
Minimum SMD resistor and capacitor: 0201 Solderability inner shielding
Minimum BGA R-VTx: 0.15mm BGA Rework  
Nitrogen source: external Nitrogen source: NA
Reflow Soldering Nitrogen source: external PCB max. size: 350mm
PCB max. size: 400*330mm Temperature accuracy: ±1°C
Temperature accuracy: ±4°C Lead free compatible
Zones: 8  

Application

Our PCB Assembly served for many industies, such as Industry Control System, Military Products, Communication Product and so on

Service

Contact Us

Tel: 0755-2967655

E-mail: info@jinshentech.com

Add: :3/F, Block A7, Tianrui Industrial Park,Fuyuan 1 Road,Fuyong Town, Baoan District,Shenzhen,Guangdong, China

info@jinshentech.com
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